Merak3030
X-Ray Dynamic Flat Panel Detector
Merak3030 is a large-size CMOS flat panel detector with high performance, the processes used on Merak3030 is high-precision splicing technology d on large-size wafer and coupling technology d on large-area scintillator. With a feature of low
noise & power consumption and high precision & rate, Merak3030 is able to capture all tiny details and bring accurate
image information under relatively lower power consumption. Merak3030 supports performance optimization processing, ded image processing, 10G network image transmission and redundant backup design, it provides a more convenient and reliable method on image processing and transmitting. Merak3030 is widely used in high-end medical imaging field.
noise & power consumption and high precision & rate, Merak3030 is able to capture all tiny details and bring accurate
image information under relatively lower power consumption. Merak3030 supports performance optimization processing, ded image processing, 10G network image transmission and redundant backup design, it provides a more convenient and reliable method on image processing and transmitting. Merak3030 is widely used in high-end medical imaging field.
Product Features
100μm pixel size
3000×3000 pixel matrix
Applications
- Mobile C-arm
- DSA
- Other specialty CBCT
Specfication
Transducers
Type
CMOS
Pixel size
100µm
Pixel matrix
3240×3000
Effective area
324×300mm²
Scintillator
CsI
Energy Range
40kV~125kV
Function
Acquisition mode
Continuous/Synchronous
Trig mode
Internal/External
ROI
Programmable size and location
Other
Interface
RJ45(Ethernet protocol interface)
Power supply
DC24V±10%
Consumption
≤30W
Usage environment
+10ºC~+40ºC
Storage environment
-20ºC~+55ºC
Product Comparison
Comparison
Model | Type | Pixel size | Pixel matrix | Effective area | Rate | Scintillator | Irradiation lifetime | Energy Range | Acquisition mode | Trig mode | ROI | Interface | Power supply | Consumption | Usage environment | Storage environment | Weight | External dimensions(W×L×H) | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Merak1313 | CMOS | 100μm | 1280×1280 | 128×128 mm² | CsI | 40kV~120kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45 (以太网协议接口,GigE 1G) | DC12V±10% | ≤10W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak1412 | CMOS | 100μm | 1404×1204 | 140.4×120.4mm² | CsI | 40kV~120kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45 (以太网协议接口,GigE 1G) | DC12V±10% | ≤10W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak1215A | CMOS | 49.5μm | 2940×2342 | 115.9×145.5 mm² | CsI | 20kV~90kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45 (以太网协议接口,GigE 1G) | DC12V±10% | ≤6W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak1613S | a-Si (TFT) | 125μm | 1274×1024 | 159.3×128 mm² | CsI | 40kV~125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45 (以太网协议接口,GigE 1G) | DC24V±10% | ≤12W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak1615 | CMOS | 100µm | 1600×1500 | 160×150mm² | CsI | 40kV~125kV | 连续触发/触发模式 | 内触发/外触发 | X×Y [X列数、Y行数,X、Y=2n,最小为16] | RJ45 (以太网协议接口,GigE 1G) | DC12V±10% | ≤10W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak1917Z | IGZO (TFT) | 120µm | 1536×1386 | 184.3×166.3mm² | CsI | 40kV~125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45(以太网协议接口,GigE 1G) | DC24V±10% | ≤10W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak2121 | CMOS | 135µm | 1504×1560 | 203×211mm² | CsI | 40kV~125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45(以太网协议接口,GigE 1G) | DC(12V~24V)±10% | ≤15W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak3030Z | IGZO (TFT) | 148µm | 2048×2048 | 303.1×303.1mm² | Csl | 40kV~125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45(以太网协议接口,GigE 10G) | DC24V±10% | ≤20W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak3040 | CMOS | 100µm | 4320×3000 | 432×300mm² | CsI | 40kV~125kV | 连续模式/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45(以太网协议接口,GigE 10G) | DC24V±10% | TBD | +10ºC~+40ºC | -20ºC~+55ºC |