Merak3030
X-Ray Dynamic Flat Panel Detector
Merak3030 is a large-size CMOS flat panel detector with high performance, the processes used on Merak3030 is high-precision splicing technology d on large-size wafer and coupling technology d on large-area scintillator. With a feature of low
noise & power consumption and high precision & rate, Merak3030 is able to capture all tiny details and bring accurate
image information under relatively lower power consumption. Merak3030 supports performance optimization processing, ded image processing, 10G network image transmission and redundant backup design, it provides a more convenient and reliable method on image processing and transmitting. Merak3030 is widely used in high-end medical imaging field.
Product Features
100μm pixel size
3000×3000 pixel matrix
Applications
- Mobile C-arm
- DSA
- Other specialty CBCT
Mobile C-arm
DSA
Other specialty CBCT
Specfication
Transducers
Type
CMOS
Pixel size
100µm
Pixel matrix
3240×3000
Effective area
324×300mm²
Scintillator
CsI
Energy Range
40kV~125kV
Function
Acquisition mode
Continuous/Synchronous
Trig mode
Internal/External
ROI
Programmable size and location
Other
Interface
RJ45(Ethernet protocol interface)
Power supply
DC24V±10%
Consumption
≤30W
Usage environment
+10ºC~+40ºC
Storage environment
-20ºC~+55ºC
Product Comparison
Comparison
Model Type Pixel size Pixel matrix Effective area Rate Scintillator Irradiation lifetime Energy Range Acquisition mode Trig mode ROI Interface Power supply Consumption Usage environment Storage environment Weight External dimensions(W×L×H)
Merak1313 CMOS 100μm 1280×1280 128×128 mm² CsI 40kV~120kV 连续触发/触发模式 内触发/外触发 自定义任意尺寸 RJ45 (以太网协议接口,GigE 1G) DC12V±10% ≤10W +10ºC~+40ºC -20ºC~+55ºC
Merak1412 CMOS 100μm 1404×1204 140.4×120.4mm² CsI 40kV~120kV 连续触发/触发模式 内触发/外触发 自定义任意尺寸 RJ45 (以太网协议接口,GigE 1G) DC12V±10% ≤10W +10ºC~+40ºC -20ºC~+55ºC
Merak1215A CMOS 49.5μm 2940×2342 115.9×145.5 mm² CsI 20kV~90kV 连续触发/触发模式 内触发/外触发 自定义任意尺寸 RJ45 (以太网协议接口,GigE 1G) DC12V±10% ≤6W +10ºC~+40ºC -20ºC~+55ºC
Merak1613S a-Si (TFT) 125μm 1274×1024 159.3×128 mm² CsI 40kV~125kV 连续触发/触发模式 内触发/外触发 自定义任意尺寸 RJ45 (以太网协议接口,GigE 1G) DC24V±10% ≤12W +10ºC~+40ºC -20ºC~+55ºC
Merak1615 CMOS 100µm 1600×1500 160×150mm² CsI 40kV~125kV 连续触发/触发模式 内触发/外触发 X×Y [X列数、Y行数,X、Y=2n,最小为16] RJ45 (以太网协议接口,GigE 1G) DC12V±10% ≤10W +10ºC~+40ºC -20ºC~+55ºC
Merak1917Z IGZO (TFT) 120µm 1536×1386 184.3×166.3mm² CsI 40kV~125kV 连续触发/触发模式 内触发/外触发 自定义任意尺寸 RJ45(以太网协议接口,GigE 1G) DC24V±10% ≤10W +10ºC~+40ºC -20ºC~+55ºC
Merak2121 CMOS 135µm 1504×1560 203×211mm² CsI 40kV~125kV 连续触发/触发模式 内触发/外触发 自定义任意尺寸 RJ45(以太网协议接口,GigE 1G) DC(12V~24V)±10% ≤15W +10ºC~+40ºC -20ºC~+55ºC
Merak3030Z IGZO (TFT) 148µm 2048×2048 303.1×303.1mm² Csl 40kV~125kV 连续触发/触发模式 内触发/外触发 自定义任意尺寸 RJ45(以太网协议接口,GigE 10G) DC24V±10% ≤20W +10ºC~+40ºC -20ºC~+55ºC
Merak3040 CMOS 100µm 4320×3000 432×300mm² CsI 40kV~125kV 连续模式/触发模式 内触发/外触发 自定义任意尺寸 RJ45(以太网协议接口,GigE 10G) DC24V±10% TBD +10ºC~+40ºC -20ºC~+55ºC
Comparison
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