Merak1313
X-Ray Dynamic Flat Panel Detector
Merak1313 is designed d on CMOS active pixel sensor. With a feature of supper low noise and high speed & resolution, Merak1313 provides exceptional image quality even under extremely low dose which can be used in dental diagnosis, micro C-arm
and other medical imaging field.
With a standard protocol of GigE Vision, Merak1313 enables the users to acquire data in a more convenient and stable way. The
cutting-edge needle-like CsI scintillator used on Merak1313 brings high resolution images even under low dose.
and other medical imaging field.
With a standard protocol of GigE Vision, Merak1313 enables the users to acquire data in a more convenient and stable way. The
cutting-edge needle-like CsI scintillator used on Merak1313 brings high resolution images even under low dose.
Product Features
100μm pixel size
1280×1280 pixel matrix
Applications
- Dental CTBT and panoramic imaging
- Micro C-arm
- Other specialty CBCT
Specfication
Transducers
Type
CMOS
Pixel size
100μm
Pixel matrix
1280×1280
Effective area
128×128 mm²
Scintillator
CsI
Energy Range
40kV~120kV
Function
Acquisition mode
Continuous/Synchronous
Trig mode
Internal/External
ROI
Programmable size and location
Other
Interface
RJ45(Ethernet protocol interface)
Power supply
DC12V±10%
Consumption
≤10W
Usage environment
+10ºC~+40ºC
Storage environment
-20ºC~+55ºC
Product Comparison
Comparison
Model | Type | Pixel size | Pixel matrix | Effective area | Rate | Scintillator | Irradiation lifetime | Energy Range | Acquisition mode | Trig mode | ROI | Interface | Power supply | Consumption | Usage environment | Storage environment | Weight | External dimensions(W×L×H) | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Merak1412 | CMOS | 100μm | 1404×1204 | 140.4×120.4mm² | CsI | 40kV~120kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45 (以太网协议接口,GigE 1G) | DC12V±10% | ≤10W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak1215A | CMOS | 49.5μm | 2940×2342 | 115.9×145.5 mm² | CsI | 20kV~90kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45 (以太网协议接口,GigE 1G) | DC12V±10% | ≤6W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak1613S | a-Si (TFT) | 125μm | 1274×1024 | 159.3×128 mm² | CsI | 40kV~125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45 (以太网协议接口,GigE 1G) | DC24V±10% | ≤12W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak1615 | CMOS | 100µm | 1600×1500 | 160×150mm² | CsI | 40kV~125kV | 连续触发/触发模式 | 内触发/外触发 | X×Y [X列数、Y行数,X、Y=2n,最小为16] | RJ45 (以太网协议接口,GigE 1G) | DC12V±10% | ≤10W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak1917Z | IGZO (TFT) | 120µm | 1536×1386 | 184.3×166.3mm² | CsI | 40kV~125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45(以太网协议接口,GigE 1G) | DC24V±10% | ≤10W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak2121 | CMOS | 135µm | 1504×1560 | 203×211mm² | CsI | 40kV~125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45(以太网协议接口,GigE 1G) | DC(12V~24V)±10% | ≤15W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak3030 | CMOS | 100µm | 3240×3000 | 324×300mm² | CsI | 40kV~125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45(以太网协议接口,GigE 10G) | DC24V±10% | ≤30W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak3030Z | IGZO (TFT) | 148µm | 2048×2048 | 303.1×303.1mm² | Csl | 40kV~125kV | 连续触发/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45(以太网协议接口,GigE 10G) | DC24V±10% | ≤20W | +10ºC~+40ºC | -20ºC~+55ºC | |||||
Merak3040 | CMOS | 100µm | 4320×3000 | 432×300mm² | CsI | 40kV~125kV | 连续模式/触发模式 | 内触发/外触发 | 自定义任意尺寸 | RJ45(以太网协议接口,GigE 10G) | DC24V±10% | TBD | +10ºC~+40ºC | -20ºC~+55ºC |